Thermally and Electrically Conductive Interface

ABSTRACT

A thermally and electrically conductive material is provided as a mixture of a dimethylpolysiloxane, metal (or one metal coated with another metal) flakes and/or granules, a peroxide-based and/or a dimethyl hexane based catalyst, PTFE powder and a platinum based fire retardant. The thermally and electrically conductive material may be pre-formed into a film or pad and each side of the film protected with removable release layers. The thermally and electrically conductive material may alternatively be produced in a screen-printable paste. As such, a layer of the thermally and electrically conductive paste may be screen-printed on the metal surface in a complete sheet form or as a patterned film by using a stencil patterned screen mesh. Processes for manufacturing high- and low-frequency circuits that include the interface material are also provided.

FIELD OF THE INVENTION

The present invention relates to electrical interfacing in electronicdevices and more specifically relates to using an interface material tobond a high or low frequency circuit board with a heat sink.

BACKGROUND

As electronic components become smaller and more powerful, their heatdissipation requirements also rise dramatically. With high or lowfrequency printed circuit board (PCB) assemblies when an aluminum heatsink is attached to a printed circuit board, an interface must be usedthat ensures a proper electrical connection. The interface may alsoserve as a thermal connector.

Historically, electrically (and thermally) conductive interfacematerials are mainly based on thermoset polymers, such as epoxy resins.Once a thermoset polymer is cured, it is inflexible. Thus, a majordrawback of interface materials based on thermoset polymers is theirinability to expand or contract with changes in the surroundingtemperature. Also, epoxy resins usually have a lower temperaturestability (up to about 400 F) as compared to silicones that can be usedup to about 550 F. As a result, high power PCBs based on thermosetinterfaces can exhibit weakening or even delamination at thecircuit/heat sink interface if the interface temperature exceeds about400 F due to the high heat generated during the performance of highpower electronic components that are assembled over the PCB. There is aneed, therefore, for an advancement in the art of preparing electricallyand thermally conductive interface materials and in manufacturingcircuit board assemblies using the interface material.

SUMMARY

The present invention is directed to an electrically and thermallyconductive interface material and its application in a circuit boardassembly. An electrically and thermally conductive interface material(“interface”) is provided as a mixture of a silicone-based compound,metal flakes and/or granules, flame retardant and a curing catalyst. Theinterface material may be pre-formed into a film or pad aid each side ofthe film protected with removable release layers. Each side of the filmmay also include a coating of an adhesive material that aids in couplingthe interface film with a metal surface. The interface material mayalternatively be produced in a screen-printable paste. As such, a layerof the interface material paste may be screen-printed on the metalsurface. The screen used for printing the paste on the metal surface canbe either without any stencil pattern to allow the entire metal surfaceto be covered with the paste, or the screen can be mask patternedsuitably to allow the paste applied in the corresponding pattern form onthe metal surface.

The interface material is sandwiched between a printed circuit board anda heat sink to form the circuit board assembly. The interface film canbe precut (e.g., by using a stencil to obtain complex film shapes),properly aligned and sandwiched between a printed circuit board and heatsink to form the assembly. In a multi-step press process for bonding,the assembly is cured and a laminate formed. The multi-step processincludes a first pressure treatment applied to the assembly at roomtemperature to increase surface contact and to remove air pockets, asecond pressure treatment applied to the assembly at a high temperatureto cure the interface and create a laminate; and a third pressuretreatment applied to the assembly at room temperature to controllablyreturn the assembly to room temperature. The bonding process may alsoinclude a priming function that prepares metal surfaces of the circuitboard and heat sink for receiving the interface material.

The interface material may also be applied in other formats, such asmulti-layer circuits and to fill vias and channels in a circuit board.Further, the material may serve as an interface between a circuitcomponent and a heat sink or other element.

It is expected that the invention will be useful in printed circuitboard (PCB) assemblies that operate at various frequencies. Theseinclude high frequency applications such as those used in wirelesscommunication systems (e.g., up to 40 GHz) and/or Radiofrequency (Rf)systems, as well systems that operate at much lower frequency.

The foregoing as well as other aspects, advantages, and alternativeswill become apparent to those of ordinary skill in the art by readingthe following detailed description and claims, with reference whereappropriate to the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a block diagram illustrating a circuit board assemblyaccording to an exemplary embodiment.

FIG. 2( a) is a perspective view of an interface film in sheet form.

FIG. 2( b) is a perspective view of an interface film in roll form.

FIG. 3 is a process flow of an exemplary embodiment of a manufacturingprocess of a circuit board assembly using pre-manufactured interfacefilm.

FIG. 4 is a process flow of an exemplary embodiment of a manufacturingprocess of a circuit board assembly using the interface material in ascreen-printable paste form.

FIG. 5 is a simplified schematic illustrating application of theinterface material in a multilayer assembly.

DETAILED DESCRIPTION OF AN EXEMPLARY EMBODIMENT 1. Overview

Referring to the drawings, FIG. 1 is a diagram illustrating a circuitboard assembly according to an exemplary embodiment. In the assembly,interface material 104 is sandwiched between a circuit board 102 and aheat sink 106. In operation, excess heat generated by components mountedon the circuit board 102 may be shunted through interface material 104to heat sink 106.

Generally, the interface material 104 is composed of a silicone-baseddielectric and metal flakes or granules. When cured in a hot-pressmethod, the interface material 104 also provides a mechanical bond tohelp secure the assembly. An organic catalyst is included to aid in thecuring process. A flame retardant is added to suppress any burningtendency.

The circuit board 102 is a printed (or printable) circuit board (PCB) onwhich electronic components may be mounted and may include anon-conducting substrate layer, such as a polytetrafluoroethylene (PTFE)and/or a fiberglass layer. In addition, the circuit board 102 preferablyincludes a metal base layer constructed of copper, for instance.

The heat sink 106 is a metal element, such as an aluminum, brass orcopper element configured to receive a heat transfer along a planar side(or a side contoured to any other non planer shape of the ground planeof the PCB) and to release excess heat from its other surfaces. Whilethe heat-sink may be configured as a simple rectangular block, otherconfigurations that may add additional surface area may be appropriate.

In manufacture, the interface material 104 may be applied either as ascreen-printable mixture or as a pre-formed laminate.

2. Silicone Based Electrically and Thermally Conductive Material

According to the exemplary embodiment, the electrically and thermallyconductive interface is composed of a mixture having silicone-basedcompound as the primary ingredient. The silicone-based compound may, forinstance be a dimethyl polysiloxane (DMPS), commercially available fromsources such as, Dow Corning, General Electric, Wackers, etc.Beneficially, the silicone-based compound is easily obtainable and ismore resistant to thermal shocks than other compounds such as an epoxy.Preferably, the silicone based compound is present in the interfacemixture at a concentration of about 40% to about 75% of silicone base,by weight based on the total weight of the interface material.

Metal flakes and/or granules are included in the interface mixture toprovide electrically and thermally conductive properties. Examples ofthe metal that may be used include silver, silver plated particles madeup of other materials such as aluminum, etc. The currently preferredtype is silver. The metal flakes and/or particles are about 100 to 300micrometers (microns) in average diameter, and are present in theinterface mixture at a concentration of about 20% to about 75%,preferably about 40% to about 75%, by weight (of metal) based on thetotal weight of the interface material.

A curing catalyst is included in the interface mixture to promote and/orcontrol the curing reaction. The curing catalyst may also serve as ahardener. The catalyst is present in the interface mixture at aconcentration of about 0.1% to about 10% by weight based on the totalweight of the interface material. As is understood by those skilled inthe art, other materials are added to the interface mixture to providevarious functionalities. By way of example, the interface mixture mayinclude one or more of the following components: up to about 5% byweight of the total weight of the interface mixture of benzoyl peroxide(as, e.g., a catalyst), up to about 5% by weight of the total weight ofthe interface mixture of PTFE, up to about 5% by weight based on thetotal weight of the interface mixture of 2,5-dimethylhexane, (which isthe primary catalyst) and alumina trihydrate-platinum mixture as a fireretardant. The platinum-alumina trihydrate mixture may include betweenabout 5.0% and 30.0%, by weight based on the total weight of theinterface material. The platinum-alumina trihydrate mixture may includebetween about 0.1% and 2.0% platinum metal in alumina hydrate by weightbased on the total weight of the platinum-alumina trihydrate mixtureitself.

3. Laminate Layer

In an exemplary embodiment, the interface material is pre-manufactured(Pre-formed) film (laminate) that can be placed between the circuitboard and the heat sink during assembly.

FIG. 2( a) provides an exemplary embodiment of the interface film in asheet form. As manufactured, a protected interface film 200 includes theinterface film 204, a first release layer 202 protecting a first side ofthe interface film 204 and a second release layer (not shown) protectinga second side of the interface film 204. An embodiment provides sheetssized at approximately 10″×10″×6 mil. Another embodiment provides sheetssized at approximately 18″×12″×5 mil.

In operation, the release layers are removed to reveal the bareinterface film 204 prior to placing the film within the circuit boardassembly.

FIG. 2( b) provides an exemplary embodiment of the interface film in aroll form. As manufactured a rolled protected interface film 250includes the rolled interface film 256, a first rolled release layer 252protecting a first side of the rolled interface film 256 and a secondrelease layer (not shown) protecting a second side of the rolledinterface film 256. A roll 258 allows a large amount of interface filmto be stored without unduly bending or crimping the film. In operation,a portion of the rolled protected interface film 250 may be unrolled andcut according to manufacturing needs. As used herein, the term“interface film” includes, but is not limited to, the sheet form and therolled form.

In the exemplary embodiment, the mixture as described provides adhesiveproperties. However, in a further embodiment, an adhesive is includedwith the interface film to promote bonding with the metal surfaces ofthe heat sink and circuit board. In one application, the adhesive isadded to the surface of both sides of the interface film prior toapplication of the release layer. In an alternative application, theadhesive is added to the interface mixture prior to forming it as afilm.

4. Lamination Process

FIG. 3 provides an exemplary process flow for manufacturing the circuitboard assembly with the pre-manufactured interface film. At 302, therelease layers are removed from each side of the interface film toexpose the film. At 304, the interface film is then sandwiched betweenthe circuit board and the heat sink. Although FIG. 3 shows function 302occurring prior to function 304, an embodiment provides that these stepsare executed in an intertwined function. The intertwined function mayinclude removing a first release layer from a first side of theinterface film, then pressing the exposed side against a planar side ofthe heat sink. Once the interface film is (loosely) attached to the heatsink, the second release layer is removed to expose a second side of theinterface film. The circuit board is then pressed against the secondside to form the sandwich assembly shown in FIG. 1. Of course, inanother embodiment, the intertwined function may be reversed so that theinterface film is first attached to the circuit board and then attachedto the heat sink. At this point, surfaces of the interface film arepliable and are configured to allow a high rate of surface contact.

Once the sandwich assembly is formed, at 306, a room-temperaturepressure treatment is applied to the assembly—pressing the heat sinktoward the circuit board. In operation, it is expected that thispressure treatment may be applied using a roller-assembly or othermechanisms. The room-temperature pressure treatment ideally works to (i)substantially remove any air-pockets that could reduce thermalconductivity and create ‘hot spots’ in the assembly and (ii) increasesurface contact at the circuit board/film boundary as well as the heatsink/film boundary.

At 308, a high-temperate pressure treatment is applied to theassembly—again pressing the heat sink toward the circuit board. Thehigh-temperature press is intended to promote curing of the interfacefilm as well as bonding of the interface film to the adjacent metal.Typically, the high-temperature bonding may occur at a temperature ofapproximately 330 degrees Fahrenheit and a pressure of approximately 480PSI for approximately 20 minutes. Of course, these parameters may varyaccording to a number of factors, such as the thickness and compositionof the interface layer and the particular requirements of any curingcatalyst used, for instance. In a further embodiment, thehigh-temperature pressure treatment includes application of atemperature of at least 320 degrees Fahrenheit and pressure of at least500 PSI for at least 20 minutes.

At 310, a low-temperature pressure treatment is applied to theassembly—again pressing the heat sink toward the circuit board.According to the exemplary embodiment, the low-temperature pressuretreatment is applied immediately following the high-temperature pressuretreatment. The low-temperature may be room-temperature or another valueat or below room temperature. In a further embodiment, thelow-temperature is not a fixed temperature, but is a temperature that isreduced over time during the low-temperature pressure treatment.

In the high-temperature pressure treatment, the silicone matrix formscross-links that are hardened/cured. The low-temperature pressuretreatment cools the interface down to room temperature under pressurewithout letting any air trap between the bonded layers. This may benecessary to avoid delamination of the bonded layers. Once the assemblyis cooled and properly cleaned to remove deleterious foreign materials,circuit components may be assembled on the circuit board. According tothe exemplary embodiment, the low-temperature first pressure treatmentis accomplished at a pressure of approximately 75 PSI for approximately1 minute.

In a further embodiment, the circuit board has a metal base (such as acopper) that is attached directly to the interface film. Likewise, aplanar surface of the heat sink is the portion attached to the otherside of the interface film.

Prior to attaching the circuit board and heat sink to the interfacefilm, it may be appropriate to prepare the metal surfaces—thus helpingto ensure better adhesion to the film. The preparation may include, forinstance, degreasing, chemical cleaning, desmutting, physical rougheningof the metal surface, cleaning the surface with alcohol and applying athin coat of a primer material. This conditions the bondable metalsurfaces for better adhesion with the silicone material.

In a further embodiment, the outer surface of the aluminum surface maybe given a surface finish of nickel and/or gold.

In another embodiment, anodizing the planar surface of the heat sink mayserve to prepare the surface for binding with the interface film.

In an exemplary embodiment, the end result of the lamination process isthat the circuit board assembly becomes a single element—the interfacefilm bonded securely with both the metal bottom of the PCB and theplanar surface of the heat sink. In some cases, excess interfacematerial from an edge of the assembly may be trimmed.

5. Screen-Printing Process

In another exemplary embodiment, the thermally and electricallyconductive mixture is provided in a screen-printable paste form. Thescreen printable form may provide a lower cost mechanism for creating athermally and electrically conductive interface between the circuitboard and the heat sink.

FIG. 4 provides an exemplary process flow for manufacturing the circuitboard assembly with the thermally and electrically conductive mixture inscreen-printable paste form. At 402, the metal surfaces of the circuitboard and heat sink are cleaned and primed. As described above, this mayinclude degreasing, chemical cleaning, desmutting, and physicalroughening of the metal surface and then cleaning the surface withalcohol and applying a thin coat of a primer material.

At 404 an interface layer is screen printed onto one of the metalsurfaces. According to various embodiments, either the metal base of theprinted circuit board or the planar surface of the heat sink receivesthe screen printed layer. The screen printing may be adjusted to applyvarious layer thicknesses and pattern according to manufacturingspecifications; in addition, the screen printing may be patterned toavoid artifacts in the circuit board such as vias and posts, forinstance. The screen patterning technique includes stencil formation ofrequired pattern on the screen. In a further embodiment, thescreen-printing step is repeated until the interface layer is of adesired thickness. The screen printing can be performed manually or by ascreen printing machine.

At 406 the interface layer is then sandwiched between the circuit boardand the heat sink to create the assembly.

Once the sandwich assembly is formed, at 408, a room-temperaturepressure treatment is applied to the assembly—pressing the heat sinktoward the circuit board. In operation, it is expected that thisroom-temperature pressure treatment may be applied using aroller-assembly or other mechanisms (as may the other pressuretreatments). The room-temperature pressure treatment ideally works to(i) substantially remove any air-pockets that could reduce thermalconductivity and create ‘hot spots’ in the assembly and (ii) increasesurface contact at the circuit board/film boundary as well as the heatsink/film boundary. Of course, the room temperature press may provideother benefits.

At 410, a high-temperate pressure treatment is applied to theassembly—again pressing the heat sink toward the circuit board. Thehigh-temperature press is intended to promote curing of the interfacefilm as well as bonding of the interface film to the adjacent metal.Typically, the high-temperature bonding may be performed at atemperature of approximately 330 degrees Fahrenheit and a pressure ofapproximately 480 PSI for a duration of approximately 20 minutes. Ofcourse, these parameters may vary according to a number of factors, suchas the thickness and composition of the interface layer and theparticular requirements of any curing catalyst used, for instance. In afurther embodiment, the high-temperature pressure treatment includesapplication of a temperature of at least 320 degrees Fahrenheit and apressure of at least 500 PSI for a duration of at least 20 minutes.

At 412, a low-temperature pressure treatment is applied to theassembly—again pressing the heat sink towards the circuit board.According to the exemplary embodiment, the low-temperature pressuretreatment is applied immediately following the high-temperature pressuretreatment. According to the exemplary embodiment, the low-temperaturepressure treatment is accomplished at approximately 200 PSI forapproximately for 10 minutes or until the assembly is properly cooled.

6. Alternative Embodiments

Of course, the silicone-based interface as described may be useful inmore arenas than those specifically described in the examples above. Forinstance, FIG. 5 shows a multilayer circuit board using the interface. Amultilayer printed circuit board may have multiple layers 508, 506 thatare separated by a first interface 510. Thermal vias 514, 512 maythermally couple the first interface 510 with a second interface 504. Ofcourse, there could be more circuit layers accompanied withcorresponding conducting interface material locations, with theinterface material serving as a conduit of heat and current to the sink.The second interface 504 being coupled with a heat sink 502.

In the embodiment of FIG. 5, the interface layers 504, 510 may be eitherpre-manufactured interface films or screen-printed interface layers.Filling the vias 514, 512 may be accomplished via screen-printing,injection, or other mechanical methods, for instance. Of course, FIG. 5is a simplified embodiment. A working embodiment may include a greaternumber of thermal vias as well as more circuit board layers. Theinterface may also be useful to fill thermal channels that, forinstance, shunt waste heat to an edge of the circuit board. The thermalchannels may be filled in a similar fashion as the thermal vias. In adouble-sided circuit board, the interface may also be used to shuntwaste heat to a heat sink.

In yet another embodiment, the thermally and electrically conductivematerial may be used to couple an electronic component directly to aheat sink. For instance, the interface may be used to couple aprocessor, a LED device, an electric motor, or a power source directlywith a heat sink.

7. Material Properties

Typical data for a six mil thick silicone interface film is provided inTable 1. The results shown in Table 1 are a summary of data obtainedfrom test results performed on a preformed electrically and thermallyconductive layer constructed in accordance with an exemplary embodiment.

TABLE 1 Test Method Property Value ASTM D3767 Thickness 6 mil. ASTM D412Tensile Strength >200 PSI ASTM D2240 Hardness (Shore A) 80-90 ASTM D412Elongation >200% Tear Strength >60 PPI ASTM D5470 Thermal Conductivity0.6 to 25.0 W/m-K MIL G 83528 Electrical Resistivity <0.0007 ohmcm

Of course, other embodiments may be constructed to achieve alternativeresults. For instance, an interface film may be manufactured with anythickness ranging from 5 mil upwards According to a preferredembodiment, it is important to maintain a substantially uniformthickness across a manufactured film in order to ensure a strong bondwith the circuit board and heat sink.

8. Conclusion

A set of exemplary embodiments of the present invention has beendescribed above. Those skilled in the art will understand, however, thatchanges and modifications may be made to these embodiments withoutdeparting from the true scope and spirit of the present invention, whichis defined by the claims. For instance, in the process flowdescriptions, certain steps may be removed or modified or eliminatedwithout destroying utility of the process as a whole. Likewise,descriptions of the use of the interface material should not be seen tolimit their use to those embodiments alone.

1.-19. (canceled)
 20. A method of manufacturing a high or low frequencycircuit board assembly having improved heat dissipation functionalitycomprising: providing a thermally and electrically conductive interfacefilm including: a first side and a second side wherein the interfacefilm comprises dimethyl polysiloxane, fire retardant, metal flakesand/or particles, a peroxide based catalyst, a first release layerprotecting the first side, and a second release layer protecting thesecond side; removing the release layers; sandwiching the interfacebetween a metal base layer of a printed circuit board and a planar sideof a heat sink to form the assembly; in a hot press, applying a lowpressure treatment to the assembly to increase surface contact and toremove air pockets; in the above hot press, applying a high pressuretreatment to the assembly at a high temperature to cure the interfaceand create a bonded laminate; and in a cold press, applying a lowpressure treatment to the assembly at a low temperature to controllablyreturn the assembly to room temperature.
 21. The method of claim 20,wherein the catalyst is peroxide based.
 22. The method of claim 20,wherein the metal flakes and or particles are silver flakes, granularsilver, silver plated metal or mixtures thereof.
 23. The method of claim20, further comprising: trimming excess interface material from an edgeof the assembly.
 24. The method of claim 20, wherein the interface filmhas a pre-laminate thickness of between 5 and 200 mils.
 25. The methodof claim 20, wherein the interface film has a pre-laminate thickness ofapproximately 6 mils.
 26. The method of claim 20 further comprising,prior to sandwiching the interface, applying a primer to the planarsurface of the printable circuit board.
 27. A method of manufacturing acircuit board assembly having improved heat dissipation functionalitycomprising: screen-printing a thermally and electrically conductiveinterface layer onto a first planar surface of one of a printablecircuit board and a heat sink, wherein the interface layer comprisesdimethylpolysiloxane, metal flakes and/or particles, and peroxide basedcatalyst.
 28. The method of claim 27 further comprising, prior toscreen-printing the interface layer, cleaning, surface roughening andapplying a primer to the planar surface of the printable circuit board.29. The method of claim 27, wherein the bonding interface material isapplied in a format selected from the list consisting of a continuousformat and a stencil patterned format, and the method furthercomprising: repeating the screen-printing function a predeterminednumber of times to achieve a desired interface thickness.
 30. The methodof claim 27, wherein the screened interface material has a pre-laminatethickness of between 5 and 200 mils.
 31. The method of claim 27, furthercomprising a first pressure treatment that includes application of apressure of at least 60 PSI for at least 30 seconds
 32. The method ofclaim 31, further comprising a second pressure treatment that includesapplication of a pressure of approximately 480 PSI at a temperature ofat least 200 F for approximately 20 minutes.
 33. The method of claim 32,further comprising a third pressure treatment that includes applicationof a pressure of approximately 200 PSI for approximately 10 minutes.